Description
According to the immersion model or angle of the wafer in the plating solution, the electroplating machine is divided into horizontal electroplating machine (also known as fountain electroplating machine or cup electroplating machine) and vertical electroplating machine.
The different types of machines determine the performance of the flow model and electric field, and subsquently the uniformity of the coating will also be different.
Semycore offers manual and semi-automatic fountain/cup plating machines and vertical plating machines for mass production; We provide customized designs with independent intellectual property according to specific process requirements to ensure efficient deposition of metal ions and good uniformity of plating.
根据晶圆在镀液中的浸泡方式或角度，电镀机台分为水平电镀机台（也称喷泉电镀机或者杯式的电镀机）和垂直电镀机台。
机台类型的不同决定了流场、电场的表现也有差异，镀层的均匀性也会有一定的差异。
我们提供手动和半自动的喷泉/杯式电镀机和用于大量生产的垂直电镀机台；我们根据不同的不同的工艺要求提供提自主知识产权的定制化设计，确保金属离子高效沉积，镀层均匀性好。
| Features | 特点/用途 | |
|
Foutian Type Plater |
Single side only Excellent distribution High precision, suitable for fine structures (e.g. Damascus, TSV, etc.) Wide range of current densities |
仅单面镀 |
|
Vertical Wafer Plater |
Single-sided or double-sided plating The uniformity is good Large production capacity, up to 6 wafers in one holder Used for through-hole filling for TWV, TGV, etc |
单面或者双面 |
