Description

Types of TGVs:
- High Aspect Ratio TGVs: Used in interposers for 2.5D and 3D packaging, these vias often have aspect ratios greater than 10:1.
- Low Aspect Ratio TGVs: Used in IC substrates, these vias typically have larger diameters and aspect ratios of ~1:1.
Applications:
- 2.5D/3D Packaging: TGV glass interposers provide high-density interconnections with minimal signal loss.
- IC Substrates: Glass serves as a core layer, replacing organic dielectrics, for better dimensional stability and integration density.
Advantages:
- High dimensional precision and stability.
- Excellent electrical properties with minimal signal distortion.
- Potential for cost-effective manufacturing at high volumes.

ECP-TSV