Semycore is a semiconductor wet process equipment manufacturer, mainly design and produce electrochemical deposition equipment and chemical deposition plating equipment for wafer and panels.
Technical innovation in the field of wet chemical processes as well as in the field of machine building is the driving force in all our projects.
We generate the maximum added value for our customers through intensive attention on continuous innovation, user friendliness, operational safety and „low cost of ownerhip“ in all project phases.
Through intensive, trustful collaboration with our customers in all project phases, we do generate long-term, successful partnership with our customers.
Our motto „Your Wet Process Partner“ is programme: We are the competent partner for our customers, when it comes to wet chemical tasks in the field of special equipment building. This cooperative approach leads to a conjoint project work with the aim to maximize the customer value.
PLATING: OVERVIEW
Possible Options
| Application Area: | Semiconductor, Advanced Packaging |
| Dual damascene, bumping/copper pillar, RDL, TSV/TWV/TGV (micro-via fill) | |
| Plater Types: | Rack(vertical), Fountain(horizontal) |
| Substrate Type: | Wafer(2”-12”), Panel (300mm*300mm-1000mm-1000mm) |
| Automation Level: | manual, semi-automatic |
| Substrate Holder: | single holder, multiple holder, sealing of the backside, sealing around the contact areas |
| Substrate Types | Si, SiC, GaN, Ceramic, Metal, Glass, organic substrate |
| Plating Materials: | Ag, Au, Cu, Pd, Ni, Sn |
| Tank Material: | PP, PVDF, PE, PVC |
| Power Supply: | DC, pulse |
| Anode | Insoluble, soluble |
Meet the Team
We are a team of dedicated professionals, ready to do what ever it takes to make your business grow