Description
The new plating tool was design for processing panels larger than 300x300mm² , the vertical plating cell, with patented anode shield and electrolyte distributor, generates the high -speed plating rate and achieve superior uniformity.
Pattern Plating for Panel Level Package:
- Handles panel sizes up to 515 x 510mm
- Processes up to 5 chemistries at one time（Cu/Sn/Ni/Ag/Au）
- Safe substrate and glass panel handling
- Single/Dual side plating
- Insoluble anode provides stable electrolyte performance
- Multi-zone anodes for optimized uniformity
- Dynamic anode shields for uniform high throughput plating
