Description
Wafer Plating Cell
Plating Kit L100D is designed for two-side wafer plating and size ranges from 2～4 inch.
The cell is designed with four-side overflow which generates a symmetrical convection and paddle agititor gives strong bath diffusion in via center or via bottom
L 100D is mainly used in through via filling (through wafer via/TWV)
Wafer materials including : silicon (Si), Glass (Glass), ceramic (AIN) gallium nitride (GaN), silicon carbide (SiC), etc
and the Design can be customized according to customer requirements
L100D为双面晶圆电镀设备，适合4寸及以下实验室使用，也可应用于小批量生产。
产品特点：
- 槽体设计科学，槽体四面溢流，流态均匀
- 夹具设计精密，晶圆四周导电均匀
- 电源精密，金属镀层精确厚度可控
- 主要应用于高纵横比微通孔填充。
- 适合不同材质的通孔，硅基（Si）、玻璃（Glass）、陶瓷（AIN）氮化镓（GaN）、碳化硅（SiC）、氧化锌(ZnO)等
| Product No. | Product Name | Quantity |
| L100D-V1-01 | 4-inch Wafer Plating Cell (4L ) | 1 |
| L100D-V1-02 | 4-inch Wafer Holder | 1 |
| L100D-V1-03 | Precision plating power supply for plting （30V/3A） | 1 |
| L100D-V1-04 | 4-inch Silicon Wafer Anode holder ( with Anode Bag ) | 2 |
| L100D-V1-05 | 4-inch use Paddle Agitator | 1 |
| L100D-V1-06 | Mini Filter 5″ Cartridge (0.5μm) | 1 |
| L100D-V1-07 | Plating Bath Cooling Coil | 1 |
| L100D-V1-08 | Bath Heater | 1 |
| L100D-V1-09 | Insoluble Anode | 2 |
